DOWNLOAD CALL FOR PAPERs FLYER

The joint conference invites the submission of one-page extended abstracts presenting ongoing research, recent results, or practical applications related to experimental and computational mechanics, digital image correlation, and full-field optical measurement techniques.

We particularly encourage submissions that focus on the following topics (but are not limited to):

(1) Advanced Mechatronic and Control Systems
(2) Advanced Mechatronic Systems
(3) Artificial Intelligence and Advanced Computational Methods in Experimental Mechanics
(4) Artificial Intelligence and Machine Learning in Mechatronics
(5) DIC Algorithms and Computational Methods
(6) DIC and other Optical Techniques in Experimental Mechanics
(7) DIC for Advanced Manufacturing Monitoring
(8) DIC in Materials Testing and Constitutive Model Calibration
(9) DIC Standardization and Uncertainty Quantification
(10) Digital Volume Correlation
(11) Experimental and Computational Fluid Mechanics
(12) Experimental and Computational Mechanics for Dynamic Response and Extreme Environmental Conditions
(13) Experimental and Computational Mechanics for Manufacturing and Material Behavior Analysis
(14) Experimental and Computational Mechanics for Material Characterization and Structural Mechanics Analysis
(15) Experimental and Computational Mechanics for Semiconductor Technology
(16) Experimental and Computational Mechanics in Biomechanics Application
(17) Experimental and Computational Multiscale Methodologies
(18) Global and Adaptive DIC Methods
(19) High-speed DIC and Modal Analysis
(20) Mechatronics and Control System
(21) Microscale Measurements with DIC
(22) Modern and Sustainable Industrial Engineering and Management
(23) Novel Imaging Modalities

PAPER SUBMISISON

All submissions must be in English. One-page extended abstracts should be submitted electronically in PDF format via the CMT submission system. For detailed submission guidelines, please see HERE.